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Rs. 20,000.00
Designed for modern electronics labs, this reflow oven uses a carefully profiled heating curve to melt solder paste with flawless consistency. Multiple temperature zones and accurate digital control create strong, clean joints on every component—from tiny 0402 passives to large IC packages. Quiet, efficient, and easy to operate, it brings production-quality reflow to your desktop.
In the box
Specification
| MCU | ESP32-S3 |
| WiFi frequency | 2.4GHz |
| Display | IPS 3.5inch capacitive touch (320x480 pixels) |
| Number of heating elements | 4 |
| Maximum temperature | 255 Celsius |
| Operating voltage | 230V AC |
| Power Consumption | 1200W |
| Dimensions (DxWxH) | 26.6cm x 40cm x 26.6cm |
| Weight | 5Kg |